Skip navigation

Items where Author is "Sangster, Alan J."

Items where Author is "Sangster, Alan J."

Up a level
Export as [feed] RSS
Group by: Item Type | Uncontrolled Keywords | No Grouping
Number of items: 58.

adhesive materials

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

assembly

Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2-87487-006-4 (doi:10.1109/EUMC.2008.4751375)

bumps

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

CFD

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Silaghi, Alexandru Marius and Gordan, Ioan Mircea, (eds.) Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337

convection oven

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:10.1109/IEMT.2008.5507869)

coupled simulation

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Silaghi, Alexandru Marius and Gordan, Ioan Mircea, (eds.) Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337

cure process

Sinclair, Keith I., Tilford, Tim, Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:10.1109/ESTC.2008.4684409)

curing

Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2-87487-006-4 (doi:10.1109/EUMC.2008.4751375)

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:10.1109/IEMT.2008.5507869)

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Silaghi, Alexandru Marius and Gordan, Ioan Mircea, (eds.) Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337

die attach

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

dielectric losses

Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2-87487-006-4 (doi:10.1109/EUMC.2008.4751375)

dielectric materials

Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2-87487-006-4 (doi:10.1109/EUMC.2008.4751375)

electromagnetic heating

Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2-87487-006-4 (doi:10.1109/EUMC.2008.4751375)

electronic engineering

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:10.1108/09540910710843757)

electronic products

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

end-fed probes

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

FDTD

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Silaghi, Alexandru Marius and Gordan, Ioan Mircea, (eds.) Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337

flip-chip assembly

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

flip-chip underfills

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

glob top

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

heat sensitive film

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

low power tests

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

low-loss dielectric

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

micro-electronics manufacture

Sinclair, Keith I., Tilford, Tim, Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:10.1109/ESTC.2008.4684409)

microelectronics

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129

microwave

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Silaghi, Alexandru Marius and Gordan, Ioan Mircea, (eds.) Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337

microwave curing

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

microwave devices

Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2-87487-006-4 (doi:10.1109/EUMC.2008.4751375)

microwave ovens

Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2-87487-006-4 (doi:10.1109/EUMC.2008.4751375)

microwave radiation

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

microwave system

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:10.1109/IEMT.2008.5507869)

microwave systems

Sinclair, Keith I., Tilford, Tim, Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:10.1109/ESTC.2008.4684409)

microwaves

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:10.1108/09540910710843757)

multiphysics

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Silaghi, Alexandru Marius and Gordan, Ioan Mircea, (eds.) Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337

open-ended microwave curing system

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Variable frequency microwave curing of polymer materials in microelectronics packaging applications. 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 791-796. ISBN 9781424413232 (doi:10.1109/EPTC.2007.446975)

open-ended microwave oven

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

open-oven

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

opto-electronic assembly

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

packaging

Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2-87487-006-4 (doi:10.1109/EUMC.2008.4751375)

polymer curing

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129

polymer encapsulant

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:10.1109/IEMT.2008.5507869)

polymer materials curing

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Variable frequency microwave curing of polymer materials in microelectronics packaging applications. 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 791-796. ISBN 9781424413232 (doi:10.1109/EPTC.2007.446975)

polymers

Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2-87487-006-4 (doi:10.1109/EUMC.2008.4751375)

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:10.1108/09540910710843757)

potting cure

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

relative permittivity

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

RF-ID tag bonding

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

simulation

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:10.1108/09540910710843757)

structural bonding

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

thermosetting polymer materials

Sinclair, Keith I., Tilford, Tim, Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:10.1109/ESTC.2008.4684409)

variable frequency microwave technology

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Variable frequency microwave curing of polymer materials in microelectronics packaging applications. 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 791-796. ISBN 9781424413232 (doi:10.1109/EPTC.2007.446975)

wafer processing

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

wafer scale level packaging

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

waveguide cavity resonator

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

waveguide components

Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2-87487-006-4 (doi:10.1109/EUMC.2008.4751375)

This list was generated on Thu May 24 07:07:11 2018 BST.