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Items where Author is "Ridout, Stephen"

Items where Author is "Ridout, Stephen"

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Number of items: 10.

Narania, Sailesh, Eshahawi, Tarek, Gindy, Nabil, Tang, Ying Kit, Stoyanov, Stoyan, Ridout, Stephen and Bailey, Chris (2008) Risk mitigation framework for a robust design process. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1075-1080. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684501)

Lu, Hua, Ridout, Stephen, Bailey, Christopher, Loh, Wei-Sun, Pearl, Agyakwa and Johnson, C. Mark (2008) Computer simulation of crack propagation in power electronics module solder joints. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2740-6 (print) 978-1-4244-2739-0 (online) (doi:10.1109/ICEPT.2008.4606983)

Bailey, Christopher, Tilford, Tim, Ridout, Stephen and Lu, Hua (2008) Optimizing the reliability of power electronics module isolation substrates. EngOpt 2008: International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7 (print and CD ROM)

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Yin, Chunyan, Tilford, Tim and Ridout, Stephen (2008) Predictive reliability and prognostics for electronic components: current capabilities and future challenges. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 67-72. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276460)

Ridout, Stephen, Bailey, Christopher, Dusek, Milos and Hunt, C (2007) Constitutive modeling of kinematic-hardening and damage in solder joints. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 927-933. ISBN 1-4244-0552-1 (doi:10.1109/ESTC.2006.280122)

Ridout, Stephen and Bailey, Christopher (2007) Review of methods to predict solder joint reliability under thermo-mechanical cycling. Fatigue & Fracture of Engineering Materials & Structures, 30 (5). pp. 400-412. ISSN 8756-758X (doi:10.1111/j.1460-2695.2006.01065.x)

Ridout, Stephen, Dusek, Milos, Bailey, Christopher and Hunt, Chris (2006) Assessing the performance of crack detection tests for solder joints. Microelectronics Reliability, 46 (12). pp. 2122-2130. ISSN 0026-2714 (doi:10.1016/j.microrel.2006.05.001)

Ridout, Stephen, Dusek, Milos, Bailey, Chris and Hunt, Chris (2005) Modeling and experiments on an isothermal fatigue test for solder joints. In: Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. IEEE, Piscataway, NJ, USA, pp. 478-482. ISBN 0-7803-9062-8 (doi:10.1109/ESIME.2005.1502852)

Ridout, Stephen, Dusek, Milos, Bailey, Chris and Hunt, Chris (2004) Finite element modelling of crack detection tests. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 141-146. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304033)

Ridout, Stephen, Dusek, Milos, Bailey, Chris and Hunt, Chris (2004) The effect of thermal cycle profiles on solder joint damage. In: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004). Institute of Electrical and Electronics Engineers, pp. 436-441. ISBN 983251486X

This list was generated on Wed Apr 25 21:02:43 2018 BST.