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Items where Author is "Otiaba, Kenny C."

Items where Author is "Otiaba, Kenny C."

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Number of items: 4.

Article

Otiaba, Kenny C., Okereke, M.I. and Bhatti, R.S. (2014) Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material. Applied Thermal Engineering, 64 (1–2). 51 - 63. ISSN 1359-4311 (doi:10.1016/j.applthermaleng.2013.12.006)

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S. and Ekpu, M. (2012) Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach. Engineering Failure Analysis, 28. pp. 192-207. ISSN 1350-6307 (doi:10.1016/j.engfailanal.2012.10.008)

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:10.1016/j.microrel.2012.01.015)

Thesis

Otiaba, Kenny C. (2013) Thermal and thermo-mechanical performance of voided lead-free solder thermal interface materials for chip-scale packaged power device. PhD thesis, University of Greenwich.

This list was generated on Fri Apr 27 05:23:53 2018 BST.