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Items where Author is "Okereke, Michael I."

Items where Author is "Okereke, Michael I."

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Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I., Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:10.1016/j.microrel.2013.08.006)

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