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Items where Author is "Misselbrook, P."

Items where Author is "Misselbrook, P."

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Number of items: 32.

chip-on-board packaging

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

circuit optimisation

Gwyer, D., Misselbrook, P., Bailey, C., Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304070)

computer modelling

Gwyer, D., Bailey, C., Pericleous, K., Philpott, D. and Misselbrook, P. (2003) Modelling the assembly and performance of optoelectronic packages. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 77-85. ISBN 0780370546

design of experiments

Gwyer, D., Misselbrook, P., Bailey, C., Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304070)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

finite element analysis

Gwyer, D., Misselbrook, P., Bailey, C., Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304070)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

flip-chip devices

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

integrated optoelectronics

Gwyer, D., Misselbrook, P., Bailey, C., Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304070)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

laser

Gwyer, D., Bailey, C., Pericleous, K., Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012447)

laser beam welding

Gwyer, D., Bailey, C., Pericleous, K., Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012447)

modelling

Gwyer, D., Bailey, C., Pericleous, K., Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012447)

optical backplanes

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

optical backplanes optical planar waveguides

Gwyer, D., Misselbrook, P., Bailey, C., Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304070)

optical couplers

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

optical interconnects

Misselbrook, P., Gwyer, David, Bailey, Christopher, Conway, P.P. and Williams, K. (2007) Review of the technology and reliability issues arising as optical interconnects migrate onto the circuit board. In: Lee, Y. C., Wong, C. P. and Suhir, Ephraim, (eds.) Micro- and opto-electronic materials and structures: physics, mechanics, design, reliability, packaging. Springer, Boston, pp. 361-382. ISBN 978038727974 9 (doi:10.1007/0-387-32989-7_34)

optical waveguides photodiodes

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

optoelectronic packages

Gwyer, D., Bailey, C., Pericleous, K., Philpott, D. and Misselbrook, P. (2003) Modelling the assembly and performance of optoelectronic packages. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 77-85. ISBN 0780370546

semiconductor device packaging

Gwyer, D., Bailey, C., Pericleous, K., Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012447)

semiconductor lasers

Gwyer, D., Bailey, C., Pericleous, K., Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012447)

semiconductor process modelling

Gwyer, D., Bailey, C., Pericleous, K., Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012447)

soldering

Gwyer, D., Bailey, C., Pericleous, K., Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012447)

surface emitting lasers

Gwyer, D., Misselbrook, P., Bailey, C., Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304070)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

thermal

Gwyer, D., Bailey, C., Pericleous, K., Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012447)

thermal expansion

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

thermal management (packaging)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

This list was generated on Mon May 21 19:45:45 2018 BST.