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Items where Author is "Ekere, Ndy N."

Items where Author is "Ekere, Ndy N."

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Number of items: 14.

European Synchrotron Radiation Facility (ESRF)

Jackson, Gavin J., Lu, Hua, Durairaj, Raj, Hoo, Nick, Bailey, Chris, Ekere, Ndy N. and Wright, Jon (2004) Intermetallic phase detection in lead-free solders using synchrotron X-ray diffraction. Journal of Electronic Materials, 33 (12). pp. 1524-1529. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-004-0094-x)

fatigue failures

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)

flip chip

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)

high temperature electronics

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)

intermetallic compound

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)

intermetallic compounds (IMCs)

Jackson, Gavin J., Lu, Hua, Durairaj, Raj, Hoo, Nick, Bailey, Chris, Ekere, Ndy N. and Wright, Jon (2004) Intermetallic phase detection in lead-free solders using synchrotron X-ray diffraction. Journal of Electronic Materials, 33 (12). pp. 1524-1529. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-004-0094-x)

lead-free solder

Jackson, Gavin J., Lu, Hua, Durairaj, Raj, Hoo, Nick, Bailey, Chris, Ekere, Ndy N. and Wright, Jon (2004) Intermetallic phase detection in lead-free solders using synchrotron X-ray diffraction. Journal of Electronic Materials, 33 (12). pp. 1524-1529. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-004-0094-x)

microelectronics reliability

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)

Pb-free solder

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)

power electronics

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)

reliability

Jackson, Gavin J., Lu, Hua, Durairaj, Raj, Hoo, Nick, Bailey, Chris, Ekere, Ndy N. and Wright, Jon (2004) Intermetallic phase detection in lead-free solders using synchrotron X-ray diffraction. Journal of Electronic Materials, 33 (12). pp. 1524-1529. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-004-0094-x)

solder joint

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)

synchrotron

Jackson, Gavin J., Lu, Hua, Durairaj, Raj, Hoo, Nick, Bailey, Chris, Ekere, Ndy N. and Wright, Jon (2004) Intermetallic phase detection in lead-free solders using synchrotron X-ray diffraction. Journal of Electronic Materials, 33 (12). pp. 1524-1529. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-004-0094-x)

X-ray diffraction (XRD)

Jackson, Gavin J., Lu, Hua, Durairaj, Raj, Hoo, Nick, Bailey, Chris, Ekere, Ndy N. and Wright, Jon (2004) Intermetallic phase detection in lead-free solders using synchrotron X-ray diffraction. Journal of Electronic Materials, 33 (12). pp. 1524-1529. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-004-0094-x)

This list was generated on Tue Dec 18 15:55:10 2018 GMT.