Items where Author is "Ekere, Ndy N."
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fatigue failures
Amalu, Emeka H. and Ekere, Ndy N. (2012) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)
flip chip
Amalu, Emeka H. and Ekere, Ndy N. (2012) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)
high temperature electronics
Amalu, Emeka H. and Ekere, Ndy N. (2012) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)
intermetallic compound
Amalu, Emeka H. and Ekere, Ndy N. (2012) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)
microelectronics reliability
Amalu, Emeka H. and Ekere, Ndy N. (2012) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)
Pb-free solder
Amalu, Emeka H. and Ekere, Ndy N. (2012) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)
power electronics
Amalu, Emeka H. and Ekere, Ndy N. (2012) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)
solder joint
Amalu, Emeka H. and Ekere, Ndy N. (2012) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)