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Items where Author is "Dusek, Milos"

Items where Author is "Dusek, Milos"

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(FE) computer modelling constituitive modeling crack detection creep curves Finite Element finite element analysis isothermal fatigue test kinematic-hardening mechanical testing printed circuit testing modeling resistors sensitivity analysis solder joints strain strain measurement thermal cycles thermal stress cracking
Number of items: 21.

(FE)

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2004) The effect of thermal cycle profiles on solder joint damage. In: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004). Institute of Electrical and Electronics Engineers, pp. 436-441. ISBN 983251486X

computer modelling

Ridout, Stephen, Dusek, Milos, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Hunt, Chris (2006) Assessing the performance of crack detection tests for solder joints. Microelectronics Reliability, 46 (12). pp. 2122-2130. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2006.05.001)

constituitive modeling

Ridout, Stephen, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Dusek, Milos and Hunt, C (2007) Constitutive modeling of kinematic-hardening and damage in solder joints. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 927-933. ISBN 1-4244-0552-1 (doi:https://doi.org/10.1109/ESTC.2006.280122)

crack detection

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2004) Finite element modelling of crack detection tests. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 141-146. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304033)

creep curves

Ridout, Stephen, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Dusek, Milos and Hunt, C (2007) Constitutive modeling of kinematic-hardening and damage in solder joints. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 927-933. ISBN 1-4244-0552-1 (doi:https://doi.org/10.1109/ESTC.2006.280122)

Finite Element

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2004) The effect of thermal cycle profiles on solder joint damage. In: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004). Institute of Electrical and Electronics Engineers, pp. 436-441. ISBN 983251486X

finite element analysis

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2004) Finite element modelling of crack detection tests. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 141-146. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304033)

isothermal fatigue test

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2005) Modeling and experiments on an isothermal fatigue test for solder joints. In: Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. IEEE, Piscataway, NJ, USA, pp. 478-482. ISBN 0-7803-9062-8 (doi:https://doi.org/10.1109/ESIME.2005.1502852)

kinematic-hardening

Ridout, Stephen, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Dusek, Milos and Hunt, C (2007) Constitutive modeling of kinematic-hardening and damage in solder joints. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 927-933. ISBN 1-4244-0552-1 (doi:https://doi.org/10.1109/ESTC.2006.280122)

mechanical testing printed circuit testing

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2004) Finite element modelling of crack detection tests. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 141-146. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304033)

modeling

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2005) Modeling and experiments on an isothermal fatigue test for solder joints. In: Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. IEEE, Piscataway, NJ, USA, pp. 478-482. ISBN 0-7803-9062-8 (doi:https://doi.org/10.1109/ESIME.2005.1502852)

resistors

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2004) Finite element modelling of crack detection tests. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 141-146. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304033)

sensitivity analysis

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2004) Finite element modelling of crack detection tests. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 141-146. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304033)

solder joints

Ridout, Stephen, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Dusek, Milos and Hunt, C (2007) Constitutive modeling of kinematic-hardening and damage in solder joints. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 927-933. ISBN 1-4244-0552-1 (doi:https://doi.org/10.1109/ESTC.2006.280122)

Ridout, Stephen, Dusek, Milos, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Hunt, Chris (2006) Assessing the performance of crack detection tests for solder joints. Microelectronics Reliability, 46 (12). pp. 2122-2130. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2006.05.001)

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2005) Modeling and experiments on an isothermal fatigue test for solder joints. In: Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. IEEE, Piscataway, NJ, USA, pp. 478-482. ISBN 0-7803-9062-8 (doi:https://doi.org/10.1109/ESIME.2005.1502852)

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2004) The effect of thermal cycle profiles on solder joint damage. In: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004). Institute of Electrical and Electronics Engineers, pp. 436-441. ISBN 983251486X

strain

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2004) The effect of thermal cycle profiles on solder joint damage. In: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004). Institute of Electrical and Electronics Engineers, pp. 436-441. ISBN 983251486X

strain measurement

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2004) Finite element modelling of crack detection tests. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 141-146. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304033)

thermal cycles

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2004) The effect of thermal cycle profiles on solder joint damage. In: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004). Institute of Electrical and Electronics Engineers, pp. 436-441. ISBN 983251486X

thermal stress cracking

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2004) Finite element modelling of crack detection tests. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 141-146. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304033)

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