EMERG

Otiaba, K.C., Bhatti, R.S., Ekere, N.N., Ekpu, M. and Adeyemi, J. (2011) Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device. In: Collection of Papers Presented at the 17th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC' 2011). EDA Publishing Association, Grenoble, France, pp. 115-119. ISBN 9782355000188

University of Greenwich Bursary

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy and Mallik, Sabuj (2011) Advanced thermal management materials for heat sinks used in microelectronics. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-8. ISBN 9781467306942

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy, Mallik, Sabuj, Amalu, Emeka and Otiaba, Kenny (2011) Investigation of effects of heat sinks on thermal performance of microelectronic package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 127-132. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145164)