Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2005) Modelling the Performance of Flexible Substrates for Lead-Free Applications. In: Proceedings of 7th Electronic Packaging Technology Conference, 2005. EPTC 2005. IEEE, pp. 342-346. ISBN 0780395786 (doi:10.1109/EPTC.2005.1614418)

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Abstract

In this paper, the performance of flexible substrates for lead-free applications was studied using finite element method (FEM). Firstly, the thermal induced stress in the flex substrate during the lead free solder reflow process was predicted. The shear stress at the interface between the copper track and flex was plotted. This shear stress increases with the thickness of the copper track. Secondly, an ACF flip chip was taken as a typical lead-free application of the flex substrate. The reflow effect on the reliability of ACF interconnections was analyzed. Higher stress was identified along the interface between the conductive particle and the metallization, and the interfacial stress increases with the reflow peak temperature and the coefficient of thermal expansion (CTE) of the adhesive. The moisture effect on the reliability of ACF joints were studied using a macro-micro modeling technique, the predominantly tensile stress found at the interface between the conductive particle and metallization could reduce the contact area and even cause the electrical failure. Modeling results are consistent with the findings in the experimental work

Item Type:	Conference Proceedings
Title of Proceedings:	Proceedings of 7th Electronic Packaging Technology Conference, 2005. EPTC 2005
Additional Information:	Originally presented at 7th Electronic Packaging Technology Conference, 7-9 December 2005, Singapore.
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Publisher
Last Modified:	20 Mar 2019 11:54
URI:	http://gala.gre.ac.uk/id/eprint/919

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