Stoyanov, S. ORCID: 0000-0001-6091-1226 , Kay, R., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:https://doi.org/10.1109/EPTC.2003.1271627)

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Abstract

This paper discusses results from a highly interdisciplinary research project which investigated different packaging options for ultra-fine pitch, low temperature and low cost flip-chip assembly. Isotropic Conductive Adhesives (ICAs) are stencil printed to form the interconnects for the package. ICAs are utilized to ensure a low temperature assembly process of flip-chip copper column bumped packages. Results are presented on the structural integrity of novel electroformed stencils. ICA deposits at sub-100 micron pitch and the subsequent thermo-mechanical behaviour of the flip-chip ICA joints are analysed using numerical modelling techniques. Optimal design rules for enhanced performance and thermomechanical reliability of ICA assembled flip-chip packages are formulated.

Item Type:	Conference Proceedings
Title of Proceedings:	Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003)
Additional Information:	[1] This paper was first presented at the 5th Electronics Packaging Technology Conference (EPTC 2003) held from 10-12 December 2003 in Singapore. [2] ISBN: 0780382056 (Bound Ed.); 0780382064 (CD-ROM Ed.)
Uncontrolled Keywords:	LED displays, adhesive bonding, adhesives, fine-pitch technology, flip-chip devices, microassembling, organic light emitting diodes, semiconductor device packaging, semiconductor device reliability, surface mount technology, thermal management (packaging)
Subjects:	Q Science > QA Mathematics > QA76 Computer software T Technology > TK Electrical engineering. Electronics Nuclear engineering T Technology > TP Chemical technology
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Publisher Publisher Organisation
Last Modified:	13 Mar 2019 11:31
URI:	http://gala.gre.ac.uk/id/eprint/781

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