Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: 0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318311)

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Abstract

Hybrid OECB (Opto-Electrical Circuit Boards) are expected to make a significant impact in the telecomm switches arena within the next five years, creating optical backplanes with high speed point-to-point optical interconnects. OECB's incorporate short range optical interconnects, and are based on VCSEL (Vertical Cavity Surface Emitting Diode) and PD (Photo Diode) pairs, connected to each other via embedded waveguides in the OECB. The VCSEL device is flip-chip assembled onto an organic substrate with embedded optical waveguides. The performance of the VCSEL device is governed by the thermal, mechanical and optical characteristics of this assembly. During operation, the VCSEL device will heat up and the thermal change together with the CTE mismatch in the materials, will result in potential misalignment between the VCSEL apertures and the waveguide openings in the substrate. Any degree of misalignment will affect the optical performance of the package. This paper will present results from a highly coupled modelling analysis involving thermal, mechanical and optical models. The paper will also present results from an optimisation analysis based on Design of Experiments (DOE).

Item Type:	Conference Proceedings
Title of Proceedings:	The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]
Additional Information:	[1] This paper was first presented at the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) held from 1-4 June 2004 in Las Vegas, Nevada, USA. It was given within Modeling and Simulation III Coupled Analysis Physics/Thermal/Mechanics.
Uncontrolled Keywords:	chip-on-board packaging, flip-chip devices, integrated optoelectronics, optical backplanes, optical waveguides photodiodes, surface emitting lasers, thermal expansion
Subjects:	Q Science > QA Mathematics > QA76 Computer software Q Science > QC Physics T Technology > TJ Mechanical engineering and machinery
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Publisher Publisher Organisation
Last Modified:	13 Mar 2019 11:31
URI:	http://gala.gre.ac.uk/id/eprint/773

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