Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 (2010) Modelling reliability of power electronics packaging. In: Proceedings of the ASME InterPack Conference 2009, IPACK2009. American Society of Mechanical Engineers, New York, USA, pp. 215-220. ISBN 9780791843604 (doi:10.1115/InterPACK2009-89430)

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Abstract

Power Electronics uses semiconductor technology to convert and control electrical power. Demands for efficient energy management, conversion and conservation, and the increasing take up of electronics in transport systems (i.e. all electric car) there has been tremendous growth in the use of power electronics semiconductor devices such as Insulated Gate Bipolar Transistors (IGBT's). The packaging of the power electronics devices involves a number of challenges for design engineers in terms of reliability and thermal management. For example IGBT modules will contain a number of semiconductor dies within a small footprint bonded to substrates with aluminium wires and wide area solder joints. The reliability of the package will depend on thermo-mechanical behavior of these materials. This paper details the results from a major UK project involving academics and industrial partners to investigate the reliability of IGBT modules. The focus of the presentation will be on the modelling tools developed to predict reliability and also the development of prognostics techniques to predict the remaining life of the package.

Item Type:	Conference Proceedings
Title of Proceedings:	Proceedings of the ASME InterPack Conference 2009, IPACK2009
Additional Information:	This paper forms part of the published proceedings from 2009 ASME InterPack Conference, IPACK2009 held in San Fransisco 19-23 July 2009
Uncontrolled Keywords:	minium wires, design engineers, electrical power, industrial partners, modelling tools, power electronics devices, remaining life, semiconductor technology, solder joints, thermal management, thermo-mechanical behaviors, transport systems, wide area
Subjects:	T Technology > TJ Mechanical engineering and machinery
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Publisher Organisation Organisation Organisation
Last Modified:	17 Dec 2019 15:25
URI:	http://gala.gre.ac.uk/id/eprint/7683

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