Takyi, G. and Ekere, N.N. (2010) Investigation of the effect of nitrogen and air atmospheres on solder wettability of plasma-treated HASL finish PCBs. Soldering and Surface Mount Technology, 22 (3). pp. 17-21. ISSN 0954 0911 (doi:https://doi.org/10.1108/09540911011054154)

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Abstract

Purpose – The purpose of this paper is to evaluate the effect of nitrogen and air atmospheres on the solderability testing of plasma-treated hot air solder level (HASL) finish printed circuit boards (PCBs). Design/methodology/approach – In this paper, the soldering performance of plasma-treated HASL finish PCBs in nitrogen and air atmospheres have been evaluated using the wetting balance technique. The results were compared with the performance of conventionally flux-treated samples soldered in air and nitrogen atmospheres and non-flux treated samples soldered in air. Auger chemical analysis results were also compared with the solderability test results in order to obtain a complete profile of the plasma-treated and non-treated surfaces. Findings – The results of the auger chemical analysis show high organic (carbon) levels in the control samples and a significant drop in organic levels in the plasma-treated samples. The significant drop in the level of carbon leads to a decrease in contact angle and an increase in both surface energy and solder wettability. The results indicate that plasma cleaning of PCBs prior to soldering is a viable alternative to the conventional use of flux. Originality/value – The paper indicates that the soldering performance of plasma-treated PCBs in air and nitrogen atmosphere are comparable. The findings give the motivation for the use of plasma-assisted dry cleaning for fluxless soldering.

Item Type:	Article
Uncontrolled Keywords:	plasma-treated hot air solder level (HASL), printed circuit boards (PCBs), auger chemical analysis
Subjects:	T Technology > TA Engineering (General). Civil engineering (General) T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments:	School of Engineering
Related URLs:	Organisation Publisher
Last Modified:	14 Oct 2016 09:19
URI:	http://gala.gre.ac.uk/id/eprint/7673

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