Takyi, G., Amalu, E.H. and Bernasko, P.K. (2011) Effect of solder joint integrity on the thermal performance of a TEC for a 980nm pump laser module. Soldering and Surface Mount Technology, 23 (2). pp. 115-119. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540911111120186)

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Abstract

Purpose – The purpose of this paper is to evaluate the effect of solder wettability on the thermal performance of a thermo-electric cooler (TEC) of a 980?nm pump laser module.
Design/methodology/approach – In this paper, TEC thermal performance has been evaluated using a heat pump test. The results were compared with scanning acoustic microscopy (C-SAM) results in order to have a better understanding of the thermal behaviour of the TEC. In the C-SAM experiments, images were taken at the interfaces between the housing and TEC, as well as at the interfaces between the chip-on-carrier (CoC) and TEC.
Findings – The heat pump test results indicate a strong correlation with the C-SAM test results. The C-SAM observations show good solder joint at the interface between the TEC and housing in the case of the device that yielded a good heat pump test result (11.5°C) and poor solder joints (gross de-lamination) at the interface between the TEC and housing in the case of the device that yielded a poor heat pump test result (24.4°C). The C-SAM observations did not show much difference at the interface between the CoC and TEC. The results from this study were used to qualify the post-vacuum soldered laser pump devices at JDS Uniphase, Plymouth, UK.
Originality/value – The findings presented in this paper indicate that the level of solder wettability at the interfaces between the piece parts impacts the thermal performance of the TEC.

Item Type:	Article
Uncontrolled Keywords:	acoustic testing, coolers, lasers, microscopy, solder, thermoelectricity
Subjects:	Q Science > Q Science (General) T Technology > TK Electrical engineering. Electronics Nuclear engineering
Faculty / School / Research Centre / Research Group:	Faculty of Engineering & Science
Related URLs:	Publisher
Last Modified:	14 Oct 2016 09:19
URI:	http://gala.gre.ac.uk/id/eprint/7524

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