Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

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Abstract

The future success of many electronics companies will depend to a large extent on their ability to initiate techniques that bring schedules, performance, tests, support, production, life-cycle-costs, reliability prediction and quality control into the earliest stages of the product creation process. Earlier papers have discussed the benefits of an integrated analysis environment for system-level thermal, stress and EMC prediction. This paper focuses on developments made to the stress analysis module and presents results obtained for an SMT resistor. Lifetime predictions are made using the Coffin-Manson equation. Comparison with the creep strain energy based models of Darveaux (1997) shows the shear strain based method to underestimate the solder joint life. Conclusions are also made about the capabilities of both approaches to predict the qualitative and quantitative impact of design changes.

Item Type:	Conference Proceedings
Title of Proceedings:	ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]
Additional Information:	1] This paper was first presented at the Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2002 (ITHERM 2002) held from 30 May-June 2002 in San Diego, California, USA. [2] ISBN: 0780371526 (pbk); 0-7803-7153-4 (microfiche)
Uncontrolled Keywords:	circuit reliability, computational fluid dynamics, CFD, creep, design for manufacture, ductility, electromagnetic compatibility, electronic design automation, fatigue, mesh generation, soldering, stress analysis, surface mount technology, thermal management (packaging), thermal stresses
Subjects:	Q Science > QA Mathematics > QA76 Computer software T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Science & Engineering Group School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Publisher Publisher
Last Modified:	13 Mar 2019 11:30
URI:	http://gala.gre.ac.uk/id/eprint/751

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