Alam, M.O. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2011) Introduction to adhesives joining technology for electronics. In: Alam, M.O. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, (eds.) Advanced adhesives in electronics: Materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767

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Abstract

Polymer adhesives are now considered as invaluable materials for modern-day, low-cost miniaturized consumer electronic products because of their low cost and high production throughput. This introductory chapter describes the diferent types of adhesives that are used in electronic packaging along with a brief introduction to electronic assemblies and the uses of adhesives in electronics.

Item Type:	Book Section
Additional Information:	[1] As well as contributing this introductory chapter, M.O. Alam and C. Bailey were also co-editors of the collection (see - http://gala.gre.ac.uk/7095/). C. Bailey also contributed the following chapter (see - http://gala.gre.ac.uk/7281/).
Uncontrolled Keywords:	integrated circuit, miniaturized consumer electronic products, electronic packaging, through-hole packages, surface mount packages
Subjects:	T Technology > T Technology (General) T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Publisher
Last Modified:	13 Mar 2019 11:33
URI:	http://gala.gre.ac.uk/id/eprint/7094

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