Experimental and modeling analysis of the reliability of the anisotropic conductive films
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Yin, C.Y. 
ORCID: 0000-0003-0298-0420, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C.
(2003)
Experimental and modeling analysis of the reliability of the anisotropic conductive films.
In: 2003 Proceedings 53rd Electronic Components & Technology Conference.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702.
ISBN 0780377915
ISSN 0569-5503
(doi:https://doi.org/10.1109/ECTC.2003.1216359)
Abstract
Experiments as well as computer modeling methods have been used to investigate the effect of the solder reflow process on the electrical characteristics and reliability of anisotropic conductive film (ACF) interconnections. In the experiments, the contact resistance of the ACF interconnections was found to increase after a subsequent reflow and the magnitude of this increase was strongly correlated to the peak temperature of the reflow profile. In fact, nearly 40 percent of the joints were opened (i.e. lifted away from the pad) after the reflow with a peak temperature of 260 OC while no openings was observed when the peak temperature was 210 "C. It is believed that the CTE mismatch between the polymer particle and the adhesive matrix is the main cause of this contact degradation. To understand this phenomenon better, a 3-D model of an ACF joint structure was built and Finite Element Analysis was used to predict the stress distrihution in the conductive particles, adhesive matrix and metal pads during the reflow process. The effects of the peak temperature, the CTE of the adhesive matrix and the bump height on the reliability of the ACF interconnections were discussed.
| Item Type: | Conference Proceedings |
|---|---|
| Title of Proceedings: | 2003 Proceedings 53rd Electronic Components & Technology Conference |
| Additional Information: | [1] This paper was first presented at the 53rd Electronic Components & Technology Conference (ECTC 2003) held from 27-30 May 2003 in New Orleans, Louisiana, USA. It was given within Session 17, New Materials & Interface Delamination Modeling & Experiments. [2] ISBN: 0780374304 (Bound); 0780379923 (CD-RoM). |
| Uncontrolled Keywords: | anisotropic conductive films, anisotropic magnetoresistance, assembly, conductive adhesives, contact resistance, flip chip, polymer films, semiconductor device modeling, stress, temperature |
| Subjects: | Q Science > QA Mathematics > QA76 Computer software T Technology > TJ Mechanical engineering and machinery |
| Pre-2014 Departments: | School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences |
| Related URLs: | |
| Last Modified: | 20 Mar 2019 11:54 |
| URI: | http://gala.gre.ac.uk/id/eprint/679 |
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