Hassan, Sheikh ORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2024) Thermal-mechanical analysis of a power module with parametric model order reduction. In: 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). 11-14 September 2023. Cambridge, United Kingdom. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-6. ISBN 978-0956808691; 978-1665487368 (doi:10.23919/EMPC55870.2023.10418328)

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Abstract

This paper presents parametric model order reduction (pMOR) by the Lagrange approach of matrix interpolation for the thermal-mechanical and reliability study of a power electronics module (PEM) with nonlinear behaviours. Most pre-vious research in model order reduction (MOR) studies reports thermal-mechanical simulations using a sequentially coupled method. In this research, a direct-coupled thermal-mechanical analysis, which simultaneously solves the thermal and structural governing equations, has been used to obtain thermal and defor-mation results. Furthermore, for pMOR, the linear approach of matrix interpolation is limited to linear changes between sampled-parametric points. Hence, a new way of interpolating system matrices using the Lagrange interpolation method has been adopted to implement the matrix interpolation efficiently. The parametric reduced-order model (pROM) solution by the Lagrange approach of matrix interpolation agrees well with the full-order model (FOM) and takes similar computational time as the linear (bi-linear) approach of matrix interpolation. pROM simulations offer up to 85.5 % reduction in computational time.

Item Type:	Conference Proceedings
Title of Proceedings:	24th European Microelectronics and Packaging Conference & Exhibition (EMPC). 11-14 September 2023. Cambridge, United Kingdom
Uncontrolled Keywords:	finite element method; thermal-mechanical analysis; power electronics module; reliability assessment; parametric model order reduction
Subjects:	Q Science > Q Science (General) Q Science > QA Mathematics Q Science > QA Mathematics > QA75 Electronic computers. Computer science
Faculty / School / Research Centre / Research Group:	Faculty of Engineering & Science Faculty of Engineering & Science > School of Computing & Mathematical Sciences (CMS)
Related URLs:	Publisher
Last Modified:	14 Feb 2024 09:13
URI:	http://gala.gre.ac.uk/id/eprint/45848

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