Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Experimental investigation of open-ended microwave oven assisted encapsulation process. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-8553-6 (print), 978-1-4244-8554-3 (online) (doi:10.1109/ESTC.2010.5643015)

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Abstract

An open ended microwave oven is presented with improved uniform heating, heating rates and power conversion efficiency. This next generation oven produces more uniform EM fields in the evanescent region forming part of the heating area of the oven. These fields are vital for the rapid and uniform heating of various electromagnetically lossy materials. A fibre optic temperature sensor and an IR pyrometer are used to measure in situ and in real-time the temperature of the curing materials. An automatic computer controlled closed feedback loop measures the temperature in the curing material and drives the microwave components to
obtain predetermined curing temperature cycles for efficient curing. Uniform curing of the lossy encapsulants
is achieved with this oven with typical cure cycle of 270
seconds with a ramp rate of 1oC/s and a hold period of 2
minutes. Differential scanning calorimeter based measurement for the pulsed microwave based curing of
the polymer dielectric indicates a ~ 100% degree of cure.

Item Type:	Conference Proceedings
Title of Proceedings:	Electronics System Integration Technology Conference, ESTC 2010 - Proceedings
Additional Information:	This paper was published in the Proceedings of the Conference on Electronics System-Integration Technology, held 13-16 September 2010, Berlin, Germany.
Uncontrolled Keywords:	open-ended microwave oven, curing
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Publisher Organisation Organisation
Last Modified:	12 Jul 2019 14:44
URI:	http://gala.gre.ac.uk/id/eprint/4308

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