Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging
Tools
Tools
Rizvi, M.J., Chan, Y.C., Bailey, Christopher 
ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Islam, M.N.
(2006)
Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging.
Journal of Alloys and Compounds, 407 (1-2).
pp. 208-214.
ISSN 0925-8388
(doi:10.1016/j.jallcom.2005.06.050)
Abstract
Intermetallic compound (IMC) formations of Sn–2.8Ag–0.5Cu solder with additional 1 wt% Bi were studied for Cu-substrate during soldering at 255 °C and isothermal aging at 150 °C. It was found that addition of 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder inhibits the excessive formation of intermetallic compounds during the soldering reaction and thereafter in aging condition. Though the intermetallic compound layer was Cu6Sn5, after 14 days of aging a thin Cu3Sn layer was also observed for both solders. A significant increase of intermetallic layer thickness was observed for both solders where the increasing tendency was lower for Bi-containing solder. After various days of aging, Sn–2.8Ag–0.5Cu–1.0Bi solder gives comparatively planar intermetallic layer at the solder–substrate interface than that of the Sn–2.8Ag–0.5Cu solder. The formation of intermetallic compounds during aging for both solders follows the diffusion control mechanism and the diffusion of Cu is more pronounced for Sn–2.8Ag–0.5Cu solder. Intermetallic growth rate constants for Sn–2.8Ag–0.5Cu and Sn–2.8Ag–0.5Cu–1.0Bi solders were calculated as 2.21 × 10−17 and 1.91 × 10−17 m2/s, respectively, which had significant effect on the growth behavior of intermetallic compounds during aging.
| Item Type: | Article |
|---|---|
| Uncontrolled Keywords: | soldering, interfacial reactions, intermetallic compounds, growth rate, aging |
| Subjects: | T Technology > TA Engineering (General). Civil engineering (General) |
| Pre-2014 Departments: | School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Department of Computer Science School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences |
| Related URLs: | |
| Last Modified: | 08 Oct 2019 08:18 |
| URI: | http://gala.gre.ac.uk/id/eprint/3608 |
Actions (login required)
 |
View Item |