Material properties, geometry and their effect on the fatigue life of two flip-chip models
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Lu, Hua 
ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879
(2000)
Material properties, geometry and their effect on the fatigue life of two flip-chip models.
In: ITHERM Proceedings.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71.
ISBN 0780359127
ISSN 0189-9870
(doi:10.1109/ITHERM.2000.866172)
Abstract
This paper describes how modeling technology has been used in providing fatigue life time data of two flip-chip models. Full-scale three-dimensional modeling of flip-chips under cyclic thermal loading has been combined with solder joint stand-off height prediction to analyze the stress and strain conditions in the two models. The Coffin-Manson empirical relationship is employed to predict the fatigue life times of the solder interconnects. In order to help designers in selecting the underfill material and the printed circuit board, the Young's modulus and the coefficient of thermal expansion of the underfill, as well as the thickness of the printed circuit boards are treated as variable parameters. Fatigue life times are therefore calculated over a range of these material and geometry parameters. In this paper we will also describe how the use of micro-via technology may affect fatigue life
| Item Type: | Conference Proceedings |
|---|---|
| Title of Proceedings: | ITHERM Proceedings |
| Additional Information: | [1] This paper was first presented at the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2000 (ITHERM 2000) held from 23-26 May 2000 in Las Vegas, NV, USA. [2] ISBN: 0780359127 (pbk); 0780359135 (hbk): 0780359143 (microfiche edition) |
| Uncontrolled Keywords: | fatigue, flip-chip, modeling, reliability, Coffin-Manson, underfill |
| Subjects: | Q Science > QA Mathematics T Technology > TK Electrical engineering. Electronics Nuclear engineering |
| Pre-2014 Departments: | School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences |
| Related URLs: | |
| Last Modified: | 20 Mar 2019 11:54 |
| URI: | http://gala.gre.ac.uk/id/eprint/270 |
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