Marks, A.E., Mallik, S., Ekere, N.N. and Seman, A. (2008) Effect of temperature on slumping behaviour of lead-free solder paste and its rheological simulation. 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 829-832. ISBN 97814244-28137 (Print), 978-1-4244-2814-4 (Electronic) (doi:https://doi.org/10.1109/ESTC.2008.4684459)

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Abstract

Variation in temperature can have a significant impact on the rheological characterisation of solder pastes used in the electronic assembly of surface mount devices. This paper concerns the study of the effect of temperature on slumping characteristics of lead-free solder pastes. The identification of the slumping characteristics can help in the correlation of the pastes characteristics to its printing performance. Further issues, which aid in justifying the undertaking of such a study, include the temperature differences identified both at the squeegee during the print, and during reflow. Due to these temperature variations, it is imperative to understand how slump differs with a temperature gradient

Item Type:	Book Section
Additional Information:	This paper which forms part of the published proceedings was given at the 2008 2nd Electronic System-Integration Technology Conference (ESTC), held 1-4 Sep 2008, University of Greenwich, Greenwich, London, United Kingdom.
Uncontrolled Keywords:	cement-based materials, microstructure, attenuation, stress, solder pastes, rheology
Subjects:	T Technology > T Technology (General) T Technology > TS Manufactures T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments:	School of Engineering School of Engineering > Department of Engineering Systems School of Engineering > Manufacturing Engineering Research Group
Related URLs:	Publisher Organisation
Last Modified:	27 Jan 2020 12:49
URI:	http://gala.gre.ac.uk/id/eprint/2670

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