Tilford, Tim ORCID: 0000-0001-8307-6403, Pavuluri, S., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2009) On variable frequency microwave processing of heterogeneous chip-on-board assemblies. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 927-931. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270558)

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Abstract

Variable Frequency Microwave (VFM) processing of heterogeneous chip-on-board assemblies is assessed using a multiphysics modelling approach. The Frequency Agile Microwave Oven Bonding System (FAMOBS) is capable of rapidly processing individual packages on a Chip-On-Board (COB) assembly. This enables each package to be processed in an optimal manner, with temperature ramp rate, maximum temperature and process duration tailored to the specific package, a significant benefit in assemblies containing disparate package types. Such heterogeneous assemblies may contain components such as large power modules alongside smaller modules containing low thermal budget materials with highly disparate processing requirements. The analysis of two disparate packages has been assessed numerically to determine the applicability of the dual section microwave system to curing heterogeneous devices and to determine the influence of differing processing requirements of optimal process parameters.

Item Type:	Book Section
Additional Information:	This paper forms part of the proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2009), held 10-13 August 2009, in Beijing, China. ©2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Uncontrolled Keywords:	variable frequency microwave (VFM), chip-on-board (COB) assembly, multiphysics modelling, frequency agile microwave oven bonding system (FAMOBS)
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Science & Engineering Group School of Computing & Mathematical Sciences > Computer & Computational Science Research Group School of Computing & Mathematical Sciences > Department of Computer Science School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Publisher Organisation Organisation
Last Modified:	02 Oct 2019 14:56
URI:	http://gala.gre.ac.uk/id/eprint/1652

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