Mallik, Sabuj, Thieme, Jens, Bauer, R., Ekere, Ndy, Seman, Anton, Bhatti, Rajinderpal and Durairaj, Rajkumar (2010) Study of the rheological behaviour of Sn-Ag-Cu solder pastes and their correlation with printing performance. In: EPTC 2009 Proceedings of 2009 11th Electronics Packaging Technology Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 869-874. ISBN 978-1-4244-5099-2 (Print), 978-1-4244-5100-5 (e-ISBN) (doi:https://doi.org/10.1109/EPTC.2009.5416423)

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Abstract

Solder paste plays an important role in the electronic assembly process by providing electrical, mechanical and thermal bonding between the components and the substrate. The rheological characterisation of pastes is an important step in the design and development of new paste formulations. With the ever increasing trend of miniaturisation of electronic products, the study of the rheological properties of solder pastes is becoming an integral part in the R&D of new paste formulations and in the quality monitoring and control during paste manufacture and electronic assembly process. This research work outlines some of the novel techniques which can be successfully used to investigate the rheology of leadfree solder pastes. The report also presents the results of the correlation of rheological properties with solder paste printing performance. Four different solder paste samples (namely paste P1, P2, P3 and P4) with different flux vehicle systems and particle size distributions were investigated in the study. As expected, all the paste samples showed shear thinning behaviour. Although the samples displayed similar flow behaviour at high shear rates, differences were observed at low shear rates. In the stencil printing trials, round deposits showed better results than rectangular deposits in terms of paste heights and aperture filling. Our results demonstrate a good correlation between higher paste viscosity and good printing performance. The results of the oscillatory and thixotropy tests were also successfully correlated to the printing behaviour of solder paste.

Item Type:	Conference Proceedings
Title of Proceedings:	EPTC 2009 Proceedings of 2009 11th Electronics Packaging Technology Conference
Additional Information:	[1] First published online: 18 February 2010. [2] This paper was presented at the Electronics Technology Packaging Conference, 2009, (EPTC '09), held from 9-11 December 2009, in Singapore. [3] INSPEC Accession Number: 11140985
Uncontrolled Keywords:	rheological behaviours, solder pastes, printing performance
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments:	School of Engineering School of Engineering > Department of Engineering Systems School of Engineering > Manufacturing Engineering Research Group
Related URLs:	Publisher Organisation Organisation
Last Modified:	17 Dec 2019 15:15
URI:	http://gala.gre.ac.uk/id/eprint/1619

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