Mallik, Sabuj, Ekere, Ndy, Seman, Anton and Durairaj, Rajkumar (2009) Modelling the time-dependent behaviour of solder pastes used in the electronics assembly applications. In: 11th Electronic Material and Packaging Conference (EMAP 2009), 1-2 Dec 2009, Penang, Malaysia. (Unpublished)

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Abstract

Solder paste is the most widely used bonding
material in the assembly of surface mount devices in electronic industries. It generally has a flocculated structure (show aggregation of solder particles), and hence are known to exhibit a thixotropic behavior. This is recognized by the decrease in apparent viscosity of paste material with time when subjected to a constant shear rate. The proper characterisation of this timedependent
rheological behaviour of solder pastes is crucial for
establishing the relationships between the pastes’ structure and flow behaviour; and for correlating the physical parameters with paste printing performance. In this paper, we present a novel method which has been developed for characterising the timedependent
and non-Newtonian rheological behaviour of solder
pastes as a function of shear rates. The objective of the study reported in this paper is to investigate the thixotropic build-up behaviour of solder pastes. The stretched exponential model(SEM) has been used to model the structural changes during the build-up process and to correlate model parameters with the paste printing process.

Item Type:	Conference or Conference Paper (Paper)
Additional Information:	This paper was given at the 11th International Conference on Electronics Materials and Packaging held in Penang, Malaysia December 1-3 2009
Uncontrolled Keywords:	rheology, solder paste, thixotropy , stretched exponential model
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments:	School of Engineering School of Engineering > Department of Engineering Systems School of Engineering > Manufacturing Engineering Research Group
Related URLs:	Organisation
Last Modified:	17 Dec 2019 15:37
URI:	http://gala.gre.ac.uk/id/eprint/1617

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