Durairaj, R., Man, Lam Wai, Ramesh, S., Wea, Lim Chia, Leng, Eu Poh, Ekere, N.N., Mallik, S. and Seman, A. (2009) Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives. In: Electronics Packaging Technology Conference, 2009. EPTC '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 422-426. ISBN 978-1-4244-5099-2 (print), 978-1-4244-5100-5 (e-ISBN) (doi:10.1109/EPTC.2009.5416511)

Full text not available from this repository.

Abstract

Wall-slip plays an important role in characterising the flow behaviour of solder paste materials. The wall slip arises due to the various attractive and repulsive forces acting between the solder particles and the walls of the measuring geometry.These interactions could lead to the presence of a thin solvent layer adjacent to the wall, which gives rise to slippage. The wall slip effect can play an important role in ensure successfulpaste release after the printing process. Wall-slip plays animportant role in characterising the flow behaviour of solderpastes and isotropic conductive adhesives. The study investigates the wall-slip formation in solder paste andisotropic conductive adhesives using flow visualisation technique. The slip distance was measured for parallel plate with different surface roughness in order to quantify the wallslip formations in these paste materials. An ink marker line was drawn between the parallel plate and the free surface of the sample. The parallel was rotated slowly at a constant shear rate of 0.05 sec-1 and the displacement of the ink marker was observed using a video microscope and image capturing software was utilised to capture the displacement of ink marker. From this study, it was found that the wall-slip effect was evident in all the paste materials. In addition, the different surface roughness of the parallel plates did not prevent the formation of wall-slip. This study has revealed that the wallslip effect could used to understand the flow behaviour of the paste in the stencil printing process.

Item Type:	Conference Proceedings
Title of Proceedings:	Electronics Packaging Technology Conference, 2009. EPTC '09
Additional Information:	[1] Published in the proceedings of the 2009, 11th Electronics Technology Packaging Conference, held 9-11 December 2009, in Singapore. [2] Acknowledgements (funding): The authors would like UTAR Research Fund (No 6200/R02) for the financial support.
Uncontrolled Keywords:	wall-slip behavior, solder pastes, isotropic conductive adhesives
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering
Faculty / School / Research Centre / Research Group:	Faculty of Engineering & Science
Related URLs:	Publisher Organisation Organisation
Last Modified:	14 Oct 2016 09:04
URI:	http://gala.gre.ac.uk/id/eprint/1610

Actions (login required)

View Item