Nath, Jyotishman, Mallik, Sabuj and Bora, Anil (2015) A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints. Journal of The Institution of Engineers (India): Series D Metallurgical & Materials and Mining Engineering, 96 (1). pp. 1-6. ISSN 2250-2122 (Print), 2250-2130 (Online) (doi:https://doi.org/10.1007/s40033-014-0063-3)

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Abstract

The effect of ageing and intermetallic compound formation on the surface mount solder joints and its shear strength behavior under extreme mechanical and thermal conditions have been discussed in this paper. The specimens used are solder paste (Sn3.8Ag0.7Cu), bench marker II printed circuit boards (PCB), resistors 1206 and the fabrication of solder joints makes use of conventional surface mount technology (SMT). Reflow process was carried out at a peak temperature of 250 °C and the test samples were exposed to isothermal ageing at a constant temperature of 150 °C for a period of 600 h. Shear test was conducted on the PCB’s. The shear strength of the solder joints rapidly increased during isothermal ageing to a certain time period and then started decreasing. Field emission scanning electron microscopy (FESEM) micrograph of the solder joint and energy dispersive X-ray (EDX) was performed on the solder sample to verify the formation of intermetallic compounds.

Item Type:	Article
Uncontrolled Keywords:	SMT solder joints, Shear strength, PCB, Reflow process, Isothermal ageing, FESEM, EDX, Intermetallic compounds (IC)
Subjects:	T Technology > T Technology (General)
Faculty / School / Research Centre / Research Group:	Faculty of Engineering & Science
Last Modified:	12 Oct 2016 14:20
URI:	http://gala.gre.ac.uk/id/eprint/13242

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