Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Dabek, Alexander and Bailey, Chris ORCID: 0000-0002-9438-3879 (2014) Hot nitrogen deballing of Ball Grid Arrays. In: Proceedings of the 2014 37th International Spring Seminar on Electronics Technology. Institute of Electrical and Electronics Engineers Inc., Piscataway, NJ, USA, pp. 44-49. ISBN 978-147994455-2 (doi:https://doi.org/10.1109/ISSE.2014.6887559)

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Abstract

Ball Grid Array (BGA) packages are increasingly adopted in high reliability electronics equipment. The main reliability concern is that lead-free (Pb-free) packaged BGAs bring the risks of failures due to tin whiskers growth phenomena associated with tin or tin-rich alloys. Replacing Pb-free solder balls of BGA components with tin-lead solder alloy materials is the most effective risk mitigation strategy. Post-manufacturing processes that can be used to remove (deballing) and then deposit back (reballing) BGA solder balls have been recently developed and increasingly put in practice. This paper reports on the assessment of the thermal responses of BGAs subjected to hot nitrogen (N2) deballing and details the respective conclusions about the risk of thermally induced damage.

Item Type:	Conference Proceedings
Title of Proceedings:	Proceedings of the 2014 37th International Spring Seminar on Electronics Technology
Additional Information:	© 2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. 37th International Spring Seminar on Electronics Technology (ISSE), 7-11 May 2014, Dresden, Germany.
Uncontrolled Keywords:	Ball grid arrays, Failure analysis, Nitrogen, Reliability, risk management, Tin alloys
Subjects:	Q Science > Q Science (General) Q Science > QC Physics Q Science > QD Chemistry
Faculty / School / Research Centre / Research Group:	Faculty of Engineering & Science
Last Modified:	13 Mar 2019 11:34
URI:	http://gala.gre.ac.uk/id/eprint/12571

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