Evans, Paul, Castellazzi, Alberto, Johnson, C. Mark, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2014) The optimization of thermal performance in power electronics modules. In: 2014 15th International Conference on Electronic Packaging Technology. Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 734-739. ISBN 978-1-4799-4707-2 (doi:10.1109/ICEPT.2014.6922755)

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Abstract

The development of a framework for the analysis and design optimization of power electronics module is described in this paper. This framework consists of analysis software that is capable of carrying out detailed dynamic as well as steady state electric and thermal analysis on power modules using finite difference numerical method and a black-box optimization solver that is based on the Mesh Adaptive Direct Search technique. Examples are given to show the application of the framework in the optimization of the thermal performance of a simplified module that consists of active semiconductor devices, ceramic substrate and baseplate.

Item Type:	Conference Proceedings
Title of Proceedings:	2014 15th International Conference on Electronic Packaging Technology
Additional Information:	[1] Presented and published in Proceedings of the 2014 15th International Conference on Electronic Packaging Technology (ICEPT 2014), held 12-15 August 2014,Chengdu, China. [2] Acknowledgement (funding): Hua Lu would like to acknowledge the financial support of the Clean Sky (Grant agreement no: 271788, project title: Sample power electronic module construction for testing, characterisation and manufacturability assessment, Acronym: PEMREL).
Uncontrolled Keywords:	power module, optimization, electric-thermal
Subjects:	Q Science > QA Mathematics
Faculty / School / Research Centre / Research Group:	Faculty of Liberal Arts & Sciences
Related URLs:	Publisher
Last Modified:	20 Mar 2019 11:54
URI:	http://gala.gre.ac.uk/id/eprint/12466

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