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Modelling technologies and applications

Modelling technologies and applications

Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:10.1007/978-0-387-47325-3_2)

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Abstract

Numerical modelling technology and software is now being used to underwrite the design of many microelectronic and microsystems components. The demands for greater capability of these analysis tools are increasing dramatically, as the user community is faced with the challenge of producing reliable products in ever shorter lead times.
This leads to the requirement for analysis tools to represent the interactions amongst the distinct phenomena and physics at multiple length and timescales. Multi-physics and Multi-scale technology is now becoming a reality with many code vendors.
This chapter discusses the current status of modelling tools that assess the impact of nano-technology on the fabrication/packaging and testing of microsystems. The chapter is broken down into three sections: Modelling Technologies, Modelling Application to Fabrication, and Modelling Application to Assembly/Packing and Modelling Applied for Test and Metrology.

Item Type: Book Section
Additional Information: This paper forms the second chapter of Nanopackaging: Nanotechnologies and Electronics Packaging, edited by James E. Morris (ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online)). James E. Morris DOI: 10.1007/978-0-387-47325-3_1
Uncontrolled Keywords: modelling technologies, analysis tools, nano-techology, microsystems, fabrication, packaging, testing
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Q Science > QA Mathematics > QA75 Electronic computers. Computer science
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
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Last Modified: 20 Mar 2019 11:54
URI: http://gala.gre.ac.uk/id/eprint/1228

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