Assembly and reliability of isotropic conductive adhesives for fine pitch flip-chip applications
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Stoyanov, Stoyan 
ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Kay, Robert, Durairaj, Rajkumar, Hendriksen, Mike, Desmuilliez, Marc and Ekere, Ndy
(2004)
Assembly and reliability of isotropic conductive adhesives
for fine pitch flip-chip applications.
In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA.
(Unpublished)
Abstract
Isotropic conductive adhesives (ICAs) are suitable for low temperature assembly, and have the added advantage that they are also an alternative to lead-free solders. This paper will present results from a highly interdisciplinary project into the formation and subsequent reliability of ICAs interconnects or flip-chip assembly at very fine
pitch. Experimental results will be discussed that detail the performance of novel stencils and how, together with the rheology of a particular ICA, these impact the printing behaviour at these fine dimensions. Reliability modelling will also be discussed. These models, based on finite element analysis, provide predictions of stress due to the thermal mismatch in the materials (i.e. silicon chip, polymer underfill, ICA, organic substrate, etc). Results from these models coupled with optimisation analysis have helped identify process conditions that lead to longer joint life.
| Item Type: | Conference or Conference Paper (Paper) |
|---|---|
| Additional Information: | [1] This paper was presented at the 133rd TMS Annual Meeting & Exhibition, (TMS 2004), within the Lead-Free Solders and Processing Issues Relevant to Microelectronic Packaging: Environmental and Materials Issues for Lead-Free session on 15 March 2004. |
| Uncontrolled Keywords: | flip-chip assembly, isotropic conductive adhesives, (ICA), reliability modelling |
| Subjects: | Q Science > QA Mathematics Q Science > QC Physics |
| Pre-2014 Departments: | School of Computing & Mathematical Sciences School of Engineering |
| Related URLs: | |
| Last Modified: | 05 Nov 2019 15:56 |
| URI: | http://gala.gre.ac.uk/id/eprint/11843 |
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