Rizvi, M.J., Yin, C.Y ORCID: https://orcid.org/0000-0003-0298-0420, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 (2007) Performance and reliability of flexible substrates when subjected to lead-free processing. In: 16th European Microelectronics and Packaging Conference and Exhibition 2007(EMPC 2007). Curran Associates, Inc., Red Hook, NY, USA, pp. 589-594. ISBN 9781622764662

Full text not available from this repository.

Abstract

The use of flexible substrates is growing in many applications such as computer peripherals, hand held devices, telecommunications, automotive, aerospace, etc. The drive to adopt flexible circuits is due to their ability to reduce size, weight, assembly time and cost of the final product.They also accommodate flexibility by allowing relative movement between component parts and provide a route for three dimensional packaging. This paper will describe some of the current research results from the Flex-No-Lead project, a European Commission sponsored research program. The principle aim of this project is to investigate the processing, performance, and reliability of flexible substrates when subjected to new environmentally friendly, lead-free soldering technologies. This paper will discuss the impact of specific design variables on performance and reliability. In particular the paper will focus on copper track designs, substrate material, dielectric material and solder-mask defined joints.

Item Type:	Conference Proceedings
Title of Proceedings:	16th European Microelectronics and Packaging Conference and Exhibition 2007(EMPC 2007)
Additional Information:	[1] This paper was presented at EMPC 2007 - IMAPS Europe Chapter Conference - The 16th European Microelectronics and Packaging Conference held from 17-20 June 2007 in Oulu, Finland. [2] This paper is published within the Section entitled "023 Laminates & Quality Issue". [3] This paper was probably also published in: Proceedings EMPC 2007: The 16th European Microelectronics and Packaging Conference & Exhibition, June 17-20, 2007, Oulu, Finland, produced by the International Microelectronics and Packaging Society, ISBN: 9789529975112
Uncontrolled Keywords:	flexible-substrates, Flex-No-Lead project, lead-free soldering
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering Q Science > QA Mathematics > QA75 Electronic computers. Computer science
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Department of Computer Science School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Publisher Organisation
Last Modified:	20 Mar 2019 11:54
URI:	http://gala.gre.ac.uk/id/eprint/1166

Actions (login required)

View Item