Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129

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Abstract

Heating in an idealised polymer load in a novel open-ended variable frequency microwave oven is numerically simulated using a couple solver approach. The frequency-agile microwave oven bonding system (FAMOBS)is developed to meet rapid polymer curing requirements in microelectronics and optoelectronics manufacturing. The heating of and idealised polymer load has been investigated through numerical modelling. Assessment of the system comprises of simulation of electromagnetic fields and of temperature distribution within the load. Initial simulation results are presented and contrasted with experimental analysis of field distribution

Item Type:	Article
Additional Information:	This paper forms part of the published proceedings from the International Microwave Power Institute's 41st Annual Symposium August 1-3 Vancouver, BC, Canada
Uncontrolled Keywords:	microwave, polymer curing, coupled simulation, microelectronics
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering Q Science > QA Mathematics > QA75 Electronic computers. Computer science
Pre-2014 Departments:	School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences School of Computing & Mathematical Sciences > Computer & Computational Science Research Group School of Computing & Mathematical Sciences > Department of Computer Science School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Science & Engineering Group
Related URLs:	Publisher Organisation Organisation Organisation
Last Modified:	14 Oct 2016 09:03
URI:	http://gala.gre.ac.uk/id/eprint/1127

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