Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562 , Mannan, S.H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:https://doi.org/10.1109/ICEPT.2013.6756527)

Full text not available from this repository.

Abstract

Failures caused by the electromigration (EM) are becoming a primary reliability concern of integrated circuits and electronics packaging designers and manufacturers. In the
foreseeable future, the trend of greater scale integration and further miniaturization in the microelectronics industry is expected to continue and this will make the metallization in electronics devices more susceptible to EM failures. In the last few decades, various methods and techniques have been developed and used in EM analysis and EM-aware designs, and numerical modeling in particular has become a very important tool that makes it easier to accurately understand and predict the behavior of EM under realistic environmental conditions. In this paper, a review has been carried out on EM analysis techniques and models ranging from early empirical models to recent numerical simulation method capable of solving three-dimensional EM problems.

Item Type:	Conference Proceedings
Title of Proceedings:	Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013)
Additional Information:	[1] This paper was first presented at the 2013 International Conference on Electronic Packaging Technology (ICEPT 2013) held from 11-14 August 2013 in Dalian, China. It was given within Session C - Packaging Design and Modeling, Paper No: C-31. [2] ISBN: 9781479904983; 9781479904976.
Uncontrolled Keywords:	electromigration, numerical modeling, finite element method, voids evolution
Subjects:	Q Science > QA Mathematics > QA75 Electronic computers. Computer science Q Science > QC Physics T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
Related URLs:	Publisher Publisher Organisation Organisation
Last Modified:	20 Mar 2019 11:54
URI:	http://gala.gre.ac.uk/id/eprint/10830

Actions (login required)

View Item