Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Dabek, Alexander and Bailey, Chris ORCID: 0000-0002-9438-3879 (2013) Thermo–mechanical sub–modelling of BGA components in PCB reflow. In: Proceedings of 36th International Spring Seminar on Electronics Technology, Alba Iulia, Romania, May 8-12, 2013, pp.1-8. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 253-258. ISBN 9781479900367 ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2013.6648252)

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Abstract

This paper details a sub-modelling approach to the thermo-mechanical characterisation of flip-chip Ball Grid Array (fcBGA) behaviour during PCB reflow assembly. The main advances in the outlined modelling methodology relate to: (1) accurate assessment of PCB material properties through image processing of the PCB Gerbers, (2) adoption of mesh element “birth” and “dead” technology to capture accurately the real interaction between the BGA and the PCB during reflow, and (3) detailed analysis of the mechanical behaviour of copper structures in the BGA substrate under the reflow thermal loads. The focus in the study is on the warpage behaviour of the package during PCB reflow assembly, the behaviour of 2nd level solder joints, and on the evaluation of the stress response of internal BGA substrate structures such as macro vias and copper paths in and through substrate dielectric layers. Principal conclusion from this study is that the BGA warpage is significantly reduced as a result of the assembly formation with the PCB but reflow causes partial yielding of the substrate copper structure. The modelling study identified the BGA locations that are most susceptible to damage. Stress levels and damage parameters are obtained for package materials and at material interfaces, and these can be compared with known failure limits.

Item Type:	Conference Proceedings
Title of Proceedings:	Proceedings of 36th International Spring Seminar on Electronics Technology, Alba Iulia, Romania, May 8-12, 2013, pp.1-8
Additional Information:	[1] This paper was first presented at the 36th International Spring Seminar on Electronics Technology (ISSE), 2013 held from 8-12 May 2013 in Alba Iulia, China.
Uncontrolled Keywords:	ball grid array, printed circuit board reflow,
Subjects:	Q Science > QA Mathematics > QA76 Computer software Q Science > QC Physics Q Science > QD Chemistry
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
Related URLs:	Publisher Publisher Organisation
Last Modified:	13 Mar 2019 11:34
URI:	http://gala.gre.ac.uk/id/eprint/10828

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