Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:https://doi.org/10.1109/EMAP.2012.6507864)

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Abstract

In this paper, we present the results of a modeling study that investigates the material behavior in the electroplating process for the fabrication of micro-vias into printed circuit boards. The simulations are based on the technique that allows explicit tracking of the interface between the electrolyte and the deposited metal in each time step. The control parameters are the aspect ratio, copper ions concentration and initial current density. The responseparameters are the filling time and two filling performance metrics.

Item Type:	Conference Proceedings
Title of Proceedings:	The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong
Additional Information:	[1] This paper was first presented at the 2012 14th International Conference on Electronic Materials and Packaging (EMAP) held from 13-16 December 2012 in Citygate, Lantau Island, Hong Kong. [2] ISBN: 9781467349451; 9781467349437; 9781467349444.
Uncontrolled Keywords:	electrodeposition, microvias, current density, electrolytes, electroplating, printed circuits, vias
Subjects:	Q Science > QA Mathematics > QA76 Computer software Q Science > QC Physics Q Science > QD Chemistry
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
Related URLs:	Publisher Publisher Organisation
Last Modified:	13 Mar 2019 11:34
URI:	http://gala.gre.ac.uk/id/eprint/10819

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