Experimental and modelling study on the effects of refinishing lead-free microelectronic components
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Stoyanov, Stoyan 
ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Alam, M.O., Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Tollafield, Peter
(2012)
Experimental and modelling study on the effects of refinishing lead-free microelectronic components.
In: 2012 4th Electronic System-Integration Technology Conference (ESTC).
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA.
ISBN 9781467346450
(doi:10.1109/ESTC.2012.6542213)
Abstract
Hot Solder Dip (HSD) of electronic components originally manufactured with lead-free solder finishes is seen as a potential solution for making these components available and used in high reliability and critical safety equipment. In this process, also referred as “refinishing”, tin and tin-reach alloy coatings on package terminations are replaced with tin-lead solder thus reducing the risk of failures caused by tin whisker growth. Characterising the effect of HSD process on refinished components from thermo-mechanical point of view is critical. This paper details the findings of an integrated experimental and modelling study that aimed at assessing the impact of the thermal shock induced from HSD on several different Quad Flat Package (QFP) variants and in relation to their subsequent long-term reliability.
| Item Type: | Conference Proceedings |
|---|---|
| Title of Proceedings: | 2012 4th Electronic System-Integration Technology Conference (ESTC) |
| Additional Information: | [1] This paper was first presented at the 4th Electronic System-Integration Technology Conference (ESTC 2012), held from 17-20 September 2012 in Amsterdam, The Netherlands. |
| Uncontrolled Keywords: | Hot Solder Dip, (HSD), electronic components, Quad Flat Package, (QFP) |
| Subjects: | Q Science > QA Mathematics > QA76 Computer software Q Science > QC Physics Q Science > QD Chemistry |
| Pre-2014 Departments: | School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group |
| Related URLs: | |
| Last Modified: | 20 Mar 2019 10:36 |
| URI: | http://gala.gre.ac.uk/id/eprint/10814 |
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