Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879, Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249

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Abstract

In this paper we present progresses made into understanding the improvement of the quality of electroplated copper PCB vias submitted to megasonic agitation. Depleted ion concentration in high aspect ratio vias leads to voids and incomplete deposition of copper in PCB vias and through silicon vias. This paper presents the improved quality of
electrodeposited copper in microvias with height-to-width aspect ratio (AR) of up to 8:1.

Item Type:	Conference Proceedings
Title of Proceedings:	MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop
Additional Information:	[1] This paper was first presented at the 22nd Micromechanics and Microsystems Technology Europe Workshop held from 19-22 June 2011 in Tønsberg, Norway.
Uncontrolled Keywords:	electrodeposition, electroplating, megasonic agitation, acoustic streaming, aspect ratio
Subjects:	Q Science > QA Mathematics > QA76 Computer software Q Science > QC Physics Q Science > QD Chemistry
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
Related URLs:	Publisher Organisation Organisation
Last Modified:	13 Mar 2019 11:34
URI:	http://gala.gre.ac.uk/id/eprint/10810

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