Electrodeposition of copper into PCB vias under megasonic agitation
Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249
Full text not available from this repository.Abstract
In this paper we present progresses made into understanding the improvement of the quality of electroplated copper PCB vias submitted to megasonic agitation. Depleted ion concentration in high aspect ratio vias leads to voids and incomplete deposition of copper in PCB vias and through silicon vias. This paper presents the improved quality of
electrodeposited copper in microvias with height-to-width aspect ratio (AR) of up to 8:1.
Item Type: | Conference Proceedings |
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Title of Proceedings: | MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop |
Additional Information: | [1] This paper was first presented at the 22nd Micromechanics and Microsystems Technology Europe Workshop held from 19-22 June 2011 in Tønsberg, Norway. |
Uncontrolled Keywords: | electrodeposition, electroplating, megasonic agitation, acoustic streaming, aspect ratio |
Subjects: | Q Science > QA Mathematics > QA76 Computer software Q Science > QC Physics Q Science > QD Chemistry |
Pre-2014 Departments: | School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group |
Related URLs: | |
Last Modified: | 13 Mar 2019 11:34 |
URI: | http://gala.gre.ac.uk/id/eprint/10810 |
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