Ridout, Stephen, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Dusek, Milos and Hunt, C (2007) Constitutive modeling of kinematic-hardening and damage in solder joints. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 927-933. ISBN 1-4244-0552-1 (doi:https://doi.org/10.1109/ESTC.2006.280122)

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Abstract

Solder constitutive models are important as they are widely used in FEA simulations to predict the lifetime of soldered assemblies. This paper briefly reviews some common constitutive laws to capture creep in solder and presents work on laws capturing both kinematic hardening and damage. Inverse analysis is used to determine constants for the kinematic hardening law which match experimental creep curves. The mesh dependence of the damage law is overcome by using volume averaging and is applied to predict the crack path in a thermal cycled resistor component

Item Type:	Book Section
Additional Information:	Paper originally presented at 1st Electronics Systemintegration Technology Conference, Dresden, Germany, 2006. Christopher Bailey was also the Conference Program Chair.
Uncontrolled Keywords:	constituitive modeling, kinematic-hardening, solder joints, creep curves
Subjects:	T Technology > TJ Mechanical engineering and machinery Q Science > QA Mathematics
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Publisher Organisation Organisation
Last Modified:	30 Sep 2019 14:14
URI:	http://gala.gre.ac.uk/id/eprint/1046

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