Lee, Yek, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Analysis of the thermo mechanical effects on packaging process of performance enhanced AMLCD's and the optical performance of the display. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1214-1217. ISBN 9781424405527 (doi:10.1109/ESTC.2006.280164)

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Abstract

The performance enhancement of AMLCD's has been hindered with problems encountered during the curing process, such as window framing and de-lamination of the glass and adhesive. A thermo-mechanical analysis using FEA was conducted to help optimise the design of the rugged display and enhance the optical performance.

Item Type:	Book Section
Additional Information:	Originally presented as paper at 2006 1st Electronic Systemintegration Technology Conference 5-7 Sept, 2006, Dresden, Germany.
Uncontrolled Keywords:	AMLCD, thermo-mechanics, optical performance
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering Q Science > QA Mathematics > QA75 Electronic computers. Computer science
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Department of Computer Science School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Organisation Publisher Organisation Organisation Organisation
Last Modified:	30 Sep 2019 14:12
URI:	http://gala.gre.ac.uk/id/eprint/1045

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