Strusevich, Nadezhda, Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David, Jones, Thomas, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Advances in Manufacturing, 1 (3). pp. 211-217. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-013-0039-9)

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Abstract

This paper considers the copper electrodeposition processes in microvias and investigates whether the quality of the electroplating process can be improved by acoustic streaming using megasonic transducers placed into a plating cell. The theoretical results show that acoustic streaming does not take place within the micro-via (either through or blind-via’s), however it does help improve cupric ion transport in the area close to the mouth of a via. This replenishment of cupric ions at the mouth of micro-via leads to better quality filling of the micro-via through diffusion compared to basic conditions. Experiments showing the improved quality of the filling of vias are also presented.

Item Type:	Article
Additional Information:	The final publication is available at Springer via http://dx.doi.org/10.1007/s40436-013-0039-9.
Uncontrolled Keywords:	electronics manufacturing, numerical modelling, high aspect ratio microvia, electroplating, megasonic agitation, acoustic streaming
Subjects:	Q Science > QA Mathematics
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Department of Computer Science
Last Modified:	14 Feb 2020 11:11
URI:	http://gala.gre.ac.uk/id/eprint/10389

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