Study of the time-dependent rheological behaviour of lead-free solder pastes and flux mediums used for flip-chip assembly applications
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Mallik, Sabuj (2009) Study of the time-dependent rheological behaviour of lead-free solder pastes and flux mediums used for flip-chip assembly applications. PhD thesis, University of Greenwich.
Full text not available from this repository.| Item Type: | Thesis (PhD) |
|---|---|
| Uncontrolled Keywords: | rheological behaviours, solder pastes, flux, metallurgy, flip-chip, |
| Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering |
| School / Department / Research Groups: | School of Engineering School of Engineering > Department of Engineering Systems |
| Last Modified: | 19 Apr 2012 11:22 |
| URI: | http://gala.gre.ac.uk/id/eprint/8149 |
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