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Effects of inter-metallic compound on high temperature reliability of flip chip interconnects for fine pitch applications

Effects of inter-metallic compound on high temperature reliability of flip chip interconnects for fine pitch applications

Amalu, E.H, Ekere, N.N. and Aminu, G. (2011) Effects of inter-metallic compound on high temperature reliability of flip chip interconnects for fine pitch applications. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 208-213. ISBN 9781467307581 (doi:10.1109/ICASTech.2011.6145173)

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Abstract

Solder joint is a method widely used to attach electronic chip on substrate. It is a generally knowledge that solder joint contains inter-metallic compound (IMC) at interconnects of solder bump and copper pads. The magnitude of IMC layer thickness impacts reliability of chip level packages. Extensive experimental investigations are conducted, however complementary numerical studies are needed to fully characterise the effects of IMC on high temperature reliability of flip chip (FC) assembly. In this work, thermo-mechanical response of FC lead-free solder joints to accelerated temperature cycle (ATC) is investigated using finite element analysis (FEA) code. The ANAND's model is employed to study the inelastic, nonlinear, rate dependent and visco-plastic behaviour of two models of FC48D6.3C457DC mounted on printed circuit boards (PCBs). While one model consists of conventional joints without IMC, the other is realistic with IMC embedded. In the result analysis based on damage indicators such as induced strain, stress, plastic work and hysteresis, it is found that negative impact of IMC on static structural integrity of solder joint operating at high temperature ambient is nontrivial.

Item Type: Conference Proceedings
Title of Proceedings: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings
Additional Information: [1] This paper was first presented at the 3rd International Conference on Adaptive Science and Technology (ICAST2011), held from 24-26 November 2011 in Abuja, Nigeria. [2] INSPEC Accession Number: 12526126.
Uncontrolled Keywords: solder joint, inter-metallic compound (IMC), flip chip (FC), accelerated temperature cycle (ATC), finite element analysis (FEA), printed circuit boards (PCBs)
Subjects: T Technology > T Technology (General)
T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments: School of Engineering
School of Engineering > Department of Engineering Systems
Related URLs:
Last Modified: 14 Oct 2016 09:19
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/7882

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