Packaging of LED backlights for ruggedised displays
Bailey, C., Lee, Y., Lu, H., Strusevich, N. and Yin, C. (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. International Symposium on Advanced Packaging Materials . IEEE Xplore Digital Library, Piscataway, NJ, USA, pp. 98-101. ISBN 978-1-4244-6756-3 (doi:10.1109/ISAPM.2010.5441377)Full text not available from this repository.
Light emitting diodes (LEDs) can provide a number of benefits such as adaptive light control, reduced form factor and other novel techniques to ultimately improve the performance of the display. Some of the design challenges in adopting LEDs are to fully understand their effect on the thermal management, reliability, optical and viewability performance of the display. For the display designer this requires integrated modelling and analysis tools. The paper describes optical and thermal modelling techniques used to predict key design parameters such as luminance and temperature for ruggedized electronic display's using an array of LEDs as the backlight.
|Item Type:||Conference Proceedings|
|Title of Proceedings:||International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10.|
|Uncontrolled Keywords:||Light emitting diodes (LEDs), thermal management, optical and thermal modelling techniques, luminance, ruggedized electronic display|
|Subjects:||Q Science > QA Mathematics|
Q Science > QA Mathematics > QA75 Electronic computers. Computer science
|School / Department / Research Groups:||School of Computing & Mathematical Sciences|
School of Computing & Mathematical Sciences > Department of Computer Science
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
|Last Modified:||02 Mar 2012 13:38|
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