Vibration test durability on large BGA assemblies: evaluation of reinforcement techniques
Berthou, M., Lu, H., Retailleau, P., Frémont, H., Guédon-Gracia, A., Davennel, C. and Bailey, C. (2011) Vibration test durability on large BGA assemblies: evaluation of reinforcement techniques. In: 2010 IEEE CPMT Symposium Japan, ICSJ10. IEEE Computer Society, Piscataway, USA, pp. 1-4. ISBN 9781424475933 (doi:10.1109/CPMTSYMPJ.2010.5679536)Full text not available from this repository.
The paper describes experimental and finite element modelling (FEM) analyses on BGA assemblies under vibration tests. The purpose is to evaluate reinforcement methods of large BGA submitted to vibrations. Two techniques are used in this test: a cord of glue around the BGA (`peel off joint'), and gluing all the ball matrix of the second level of the BGA (Underfilling). Comparison between SnPb and SAC alloy is also done. In all cases, failures mechanisms and Time To Failure (TTF) are compared. Failure analysis permits to follow the change in microstructure when solder balls are submitted to mechanical loading.
|Item Type:||Conference Proceedings|
|Title of Proceedings:||2010 IEEE CPMT Symposium Japan, ICSJ10|
|Additional Information:||This paper forms part of the published proceedings from 2010 IEEE CPMT Symposium Japan, ICSJ10 held in Tokyo 24-26 August 2010|
|Uncontrolled Keywords:||finite element modelling, matrix, mechanical loading, reinforcement method, reinforcement technique, SAC alloy, second level, solder balls, time to failure, underfilling, vibration test|
|Subjects:||Q Science > QA Mathematics
Q Science > QA Mathematics > QA75 Electronic computers. Computer science
|Pre-2014 Departments:||School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
|Last Modified:||14 Oct 2016 09:19|
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