Interconnect technologies using carbon nanotubes: Current status and future challenges
Bailey, C. and Lu, H. (2011) Interconnect technologies using carbon nanotubes: Current status and future challenges. In: 2011 34th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4577-2111-3 ISSN 2161-2528 (doi:10.1109/ISSE.2011.6053539)Full text not available from this repository.
Heterogeneous electronics based systems are driven by an increasing demand for smaller form factor, faster and higher-density interconnection, and miniaturisation all at a cheaper cost. 3D packaging, using through-silicon-via technology, is positioned to satisfy these requirements and Carbon Nanotubes as an interconnection technology is gaining extensive interest in the community. This paper provides a summary of the latest advances in such technology, and discusses the challenges that need to be addressed by the community in terms of modeling technologies.
|Item Type:||Conference Proceedings|
|Title of Proceedings:||2011 34th International Spring Seminar on Electronics Technology (ISSE)|
|Additional Information:|| In proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE), held 11-15 May 2011, Tratanska Lomnica|
|Uncontrolled Keywords:||heterogeneous electronics based systems, higher-density interconnection, miniaturisation, silicon, carbon-nanotubes, interconnection technology|
|Subjects:||T Technology > TK Electrical engineering. Electronics Nuclear engineering|
|School / Department / Research Groups:||School of Computing & Mathematical Sciences|
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
|Last Modified:||01 Apr 2014 16:16|
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