Numerical investigation of thermo-mechanical behaviour of ball grid array solder joint at high temperature excursion
Amalu, E.H., Ekere, N.N., Bhatti, R.S., Mallik, S., Takyi, G. and Ibhadode, A.O.A. (2011) Numerical investigation of thermo-mechanical behaviour of ball grid array solder joint at high temperature excursion. Advanced Materials Research, 367. pp. 287-292. ISSN 1662-8985 (Print), 1022-6680 (Online) (doi:10.4028/www.scientific.net/AMR.367.287)Full text not available from this repository.
The solder joints of surface mount components (SMCs) experience thermal degradation culminating in creep and plastic shear strain deformation when subjected to cyclic temperature load over time. Degradation at the joints is due to thermal stress induced by the incompatible, differential and nonlinear expansion mismatch of the different bonded materials in the assembly. The stress magnitude influences the strain behaviour. Plastic strain response of solder joint is critical at the materials interface at the lower part of the joint due to the occurrence of wider variation in the coefficient of thermal expansion of the bonded materials and this may lead to static structural failure. The life expectancy of electronic components reduces exponentially as the operating temperature increases thus making reliability a key concern for electronic systems operating at high temperatures and in harsh environments. This paper reports on the numerical investigation of thermo-mechanical response of a critical BGA joint especially the character of plastic deformation of SnPb solder used in forming the joint as well as the joint’s high temperature reliability. The analysis uses a 3-D models to predict the effect of the transient thermal load on the static structural integrity of a single BGA joint. In this study, the base diameter of solder ball (interface between the PCB, copper pad and the solder) experienced higher damage than the top diameter interconnects. The paper provides a simplified methodology to study the reliability of BGA solder joint at high temperatures excursion.
|Additional Information:|| This issue of Advanced Materials Research has the title, Advances in Materials and Systems Technologies III (9783037852705). It is a collection of peer-reviewed papers selected from those presented at the 2010 International Conference on Engineering Research and Development: Advances in Engineering, Science and Technology (ICERD2010) held at the University of Benin, Nigeria on September 7–9th, 2010|
|Uncontrolled Keywords:||high temperature electronics, solder joint reliability, surface mount components, thermal cycling, fatigue failure|
|Subjects:||T Technology > TA Engineering (General). Civil engineering (General)|
|School / Department / Research Groups:||School of Engineering|
School of Engineering > Department of Engineering Systems
|Last Modified:||09 Feb 2012 09:45|
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