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Thermal management materials for electronic control unit: trends, processing technology and R and D challenges

Thermal management materials for electronic control unit: trends, processing technology and R and D challenges

Otiaba, K.C., Ekere, N.N., Amalu, E.H., Bhatti, R.S. and Mallik, S. (2012) Thermal management materials for electronic control unit: trends, processing technology and R and D challenges. Advanced Materials Research, 367. pp. 301-307. ISSN 1022-6680 (Print), 1662-8985 (Online) (doi:10.4028/www.scientific.net/AMR.367.301)

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Abstract

The development of advanced thermal management materials for Electronic Control Unit(ECU) is the key to achieving high reliability and thus safety critical operations in areas of ECU applications such as automotives and power systems. Thermal management issues associated with the operation of ECU at elevated temperature have accounted for some of the recent reliability concerns which have culminated in current systems failures in some automobiles. As the functions of ECU in systems have increased in recent times, the number of components per unit area on its board has also risen. High board density boosts internal heat generated per unit time in ECU ambient. The generated heat induces stress and strain at the chip interconnects due to variation in the Coefficient of Thermal Expansion (CTE) and thermal conductivity of different bonded materials in the assembly. Thermal degradation could become critical and impacts device’s efficiency. The life expectancy of electronic components reduces exponentially as the operating temperature rises thus making thermal management pivotal in electronic system reliability. Since materials’ properties vary with operating condition, material performance has become a major consideration in the design of heat dissipation mechanism in ECU. The development of advanced thermal management materials and hence improving the performance of ECU requires an in-depth understanding of the complex relationship between materials’ properties and their behaviours at elevated temperatures. The paper presents an overview of thermal management materials, review trends in material and processing technology. In addition, the paper outlines the crucial challenges in materials, cost and composite formulations and the outstanding R & D issues.

Item Type: Article
Additional Information: [1] The title of this volume is Advances in Materials and Systems Technologies III. [2] This issue of Advanced Materials Research has the title, Advances in Materials and Systems Technologies III, and is a collection of peer-reviewed papers selected from those presented at the 2010 International Conference on Engineering Research and Development: Advances in Engineering, Science and Technology (ICERD2010) held at the University of Benin, Benin City, Nigeria on September 7–9th, 2010. [3] Scientific.net provides the electronic publications of Trans Tech Publications, Switzerland.
Uncontrolled Keywords: thermal management, electronic control unit, materials, processing technology
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
Pre-2014 Departments: School of Engineering
School of Engineering > Department of Engineering Systems
Related URLs:
Last Modified: 14 Oct 2016 09:18
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/7305

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