Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges
Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714Full text not available from this repository.
The under-hood automotive ambient is harsh and its impact on electronics used in electronic control unit(ECU)assembly is a concern. The introduction of Euro 6 standard (Latest European Union Legislation)leading to increase in power density of power electronics in ECU has even amplified the device thermal challenge. Heat generated within the unit coupled with ambient temperature makes the system reliability susceptible to thermal degradation which ultimately may result in failure. Previous investigations
show that the technology of thermal interface materials (TIMs) is a key to achieving good heat conductions
within a package and from a package to heat sinking device. With studies suggesting that current TIMs contribute about 60% interfacial thermal resistance, a review of engineering materials has become imperative to identify TIM that could enhance heat transfer. This paper critically reviews the state-of-theart in TIMs which may be applicable to automotive ECU. Our review shows that carbon-nanotube (CNT)
when used as the structure of TIM or TIM filler could considerably advance thermal management issues by improving heat dissipation from the ECU. This search identifies chemical vapor deposition (CVD) as a low cost process for the commercial production of CNTs. In addition, this review further highlights the capability of CVD to grow nanotubes directly on a desired substrate. Other low temperature techniques of growing CNT on sensitive substrates are also presented in this paper.
|Additional Information:|| Available online 31 May 2011.|
|Uncontrolled Keywords:||thermal, interface, automotive, electronic unit|
|Subjects:||T Technology > TA Engineering (General). Civil engineering (General)|
T Technology > TK Electrical engineering. Electronics Nuclear engineering
|School / Department / Research Groups:||School of Engineering|
School of Engineering > Department of Engineering Systems
|Last Modified:||12 Feb 2013 12:59|
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