Modelling techniques used to assess conductive adhesive properties
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Bailey, C. (2011) Modelling techniques used to assess conductive adhesive properties. In: Advanced adhesives in electronics: Materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767
Full text not available from this repository.| Item Type: | Book Section |
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| Additional Information: | [1] As well as contributing this chapter, C. Bailey was also co-editor (with M.O. Alam) of the collection (see - http://gala.gre.ac.uk/7095/) and contributed the introductory chapter (see - http://gala.gre.ac.uk/7094/). |
| Uncontrolled Keywords: | modelling techniques, |
| Subjects: | Q Science > QA Mathematics > QA75 Electronic computers. Computer science |
| School / Department / Research Groups: | School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Department of Mathematical Sciences |
| Related URLs: | |
| Last Modified: | 19 Jan 2012 16:05 |
| URI: | http://gala.gre.ac.uk/id/eprint/7281 |
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