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Modelling techniques used to assess conductive adhesive properties

Modelling techniques used to assess conductive adhesive properties

Bailey, C. (2011) Modelling techniques used to assess conductive adhesive properties. In: Alam, M.O. and Bailey, C., (eds.) Advanced adhesives in electronics: Materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767

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Item Type: Book Section
Additional Information: [1] As well as contributing this chapter, C. Bailey was also co-editor (with M.O. Alam) of the collection (see - http://gala.gre.ac.uk/7095/) and contributed the introductory chapter (see - http://gala.gre.ac.uk/7094/).
Uncontrolled Keywords: modelling techniques,
Subjects: Q Science > QA Mathematics > QA75 Electronic computers. Computer science
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:
Last Modified: 14 Oct 2016 09:18
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/7281

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